Model TS 207 - Inner Diameter Saw
From Semiconductor- Cropping & Wafering
The inner diameter saw TS 207 / 08 series crops mono-crystalline silicon ingots. During cropping the position of a cut on the ingot may be adjusted flexibly to guarantee highest yield. Test-wafers can be cut to thicknesses of 0.8 – 25 mm. Loading and unloading of the ingots can be done manually as well as semi-automatically.
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Benefits
Benefits
- High capacity, flexibility and yield
- Manual or fully automated loading and unloading
- Variable choice of cutting position on each brick
- High surface and cutting quality
Continuous processing at maximum capacity
The process-independent loading and unloading positions guarantee that the machine can be loaded and unloaded manually or automatically without interrupting the cutting process.
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